The RPS-CM12P1, 12 kW remote plasma source provides for radical enhanced deposition or selective etch pre-clean processes in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), or Physical Vapor Deposition (PVD) processes. In chamber clean applications, the RPS-CM12P1 has an increased power range and process gas flow capacity to shorten chamber clean times while maintaining the same footprint as the previous generation remote plasma source Paragon® product.
Compare | Description | Drawings, CAD & Specs | Availability | Price | |||
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RPS-CM12P1-P12C Remote Plasma Sourse, 12kW, ALD, CVD & PVD Chambers |
14 Weeks
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A new magnetics design combined with new power boost electronics reduces power losses, enhances ignition repeatability, and increases plasma stability. These design advances also provide improved product reliability and repeatable process performance results. Additional enhancements in the remote plasma source cooling design permit running mixed gas species and high recombination gas species without sacrificing the plasma block life resulting in reduced service cost. An innovative, patent pending control architecture reduces storage capacitance while adhering to SEMI F47 immunity response requirements. Power accuracy of ±1% to the user defined plasma power set point provides lower unit to-unit variation across process chambers.Â
Equipped with EtherCAT® communication protocols, the RPS-CM12P1 streams key parametric data enabling on-tool or in-fab diagnostics. When the unit does require routine maintenance, servicing the plasma block applicator can be accomplished without removing the power electronics, reducing service times.