RPS-CM12P1 Remote Plasma Source for ALD, CVD and PVD Chambers
Overview
The RPS-CM12P1, 12 kW remote plasma source provides for radical enhanced deposition or selective etch pre-clean processes in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), or Physical Vapor Deposition (PVD) processes. In chamber clean applications, the RPS-CM12P1 has an increased power range and process gas flow capacity to shorten chamber clean times while maintaining the same footprint as the previous generation remote plasma source Paragon® product.
- Compact design enables easy integration to OEM process chambers
- Increased Fluorine radical output shortens clean time cycle
- EtherCAT® communications provides fast, reliable, data streaming and unit control
- A new plasma block assembly results in fast turn maintenance
Products
| Compare | Description | Drawings, CAD & Specs | Availability | Price | |||
|---|---|---|---|---|---|---|---|
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RPS-CM12P1-P12C Remote Plasma Sourse, 12kW, ALD, CVD & PVD Chambers |
15 Weeks
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Specifications
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TypeRPS-CM12P1 Remote Plasma Source
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Power Output12 kW, 3 phase 50/60 Hz, 40 Amps RMS max phase
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RF Frequency400 kHz
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Accuracy±1% to power set point
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Gas Supply During IgnitionAr
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NF3 Process Gas1-12 slm, 1-10 T
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NF3 Operation Reactant Output1-12 slm
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Mixed Species Space30-60 slm
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THD>15%
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Inlet Gas ConnectionKF40
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Outlet Gas ConnectionKF50 or KF40
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Control InterfaceAnalog: DB25
Digital: EtherCAT -
Dimensions18.4 x 9.5 x 10.5 in. (46.73 x 24.13 x 26.67cm)
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Weight73 lbs. (33.11 kg)
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ComplianceSEMI F47
Features
RPS-CM12P1 Features
- Power Architecture
12 kW RF power output
±1% accuracy to power setting
DC boost power regulation - Process
NF3 process for chamber clean
Mixed gas species capable
Supports NF3, O2, N2, Ar - Maintenance
Plasma Electrolytic Oxide plasma block coatings for extended block life, lower operating expenses
RPS-12P1 Remote Plasma Source
A new magnetics design combined with new power boost electronics reduces power losses, enhances ignition repeatability, and increases plasma stability. These design advances also provide improved product reliability and repeatable process performance results. Additional enhancements in the remote plasma source cooling design permit running mixed gas species and high recombination gas species without sacrificing the plasma block life resulting in reduced service cost. An innovative, patent pending control architecture reduces storage capacitance while adhering to SEMI F47 immunity response requirements. Power accuracy of ±1% to the user defined plasma power set point provides lower unit to-unit variation across process chambers.Â
Equipped with EtherCAT® communication protocols, the RPS-CM12P1 streams key parametric data enabling on-tool or in-fab diagnostics. When the unit does require routine maintenance, servicing the plasma block applicator can be accomplished without removing the power electronics, reducing service times.
Resources
Literature
Drawings & CADs
- RPS-CM12P1 Remote Plasma Source Dimensional Drawing (218.3 kB, PDF)
Ultra-High Velocity