RPS-CH24P1 Remote Plasma Source for High Flow Applications

Products
Features
Resources
Contact Us

Overview

The RPS-CH24P1, 24 kW remote plasma source is designed for use with larger Atomic Layer Deposition (ALD) and Quad-style Chemical Vapor Deposition (CVD) chambers used in Semiconductor, Flat Panel Display, or Photovoltaic (PV) processes. A split-powered DC/RF design consisting of a rack mounted DC power supply and a 24 kW RF remote toroidal applicator head provides highly efficient destruction of NF3 molecules for chamber clean applications or high flow mixed gas species applications.

Compact split applicator power design provides easy integration to OEM process chambers
Increased Fluorine radical output shortens clean time cycles
EtherCAT® communication enables fast, reliable data streaming and unit control
A new plasma block assembly results in fast turn maintenance

See All Features

Products

		Compare	Description	Compatibility	sortOrder	rankScore	ranking	Drawings, CAD & Specs		Type	Gas Supply During Ignition	Availability	Featured Item	Price		Brand
		RPS-CH24P1-P24C Remote Plasma Source, 24 kW, High Flow Applications Contact Us	RPS-CH24P1-P24C Remote Plasma Source, 24 kW, High Flow Applications	UNIVERSAL	0.0	1.0	0.0		0.0	RPS-CH24P1 Remote Plasma Source	Ar	Contact Us

Show All

Specifications

Type

RPS-CH24P1 Remote Plasma Source
Power Output

24 kW
RF Frequency

400 kHz
Accuracy

±1% to power set point
Gas Supply During Ignition

Ar
NF3 Operation Reactant Output

1-25 slm 20T
Compatible Species

NF3, O2, N2, Ar
Mixed Species Space

30-90 slm
THD

<15%

Inlet Gas Connection

KF40
Outlet Gas Connection

KF50
Cooling Water Required

Remote Head: 3 gpm (11.36 Lpm)
DC Power Supply: 2 gpm (7.57 Lpm)
Control Interface

Analog: DB25
Digital: EtherCAT
Power Requirements

208 V, 3 phase 50/60 Hz, 75 Amps RMS max phase
Dimensions

Remote Head: 22.02 x 10.76 x 11.1 in. (55.93 x 27.33 x 28.19 cm)
Power Supply: 21.24 x 19.00 x 7.0 in. (53.95 x 48.26 x 17.78 cm)
Weight

Remote Head: 100 lbs. (45.36 kg)
Power Supply: 62 lbs. (28.12 kg)
Compliance

SEMI F47

Features

RPS-CH24P1 Features

Power Architecture
24 kW RF power output
±1% accuracy to power setting
DC boost power regulation
Process
NF3 species for chamber clean
Mixed gas species capable
Supports NF3, O2, N2, Ar
Maintenance
Plasma Electrolytic Oxide plasma block coatings for extended block life, lower operating expenses

RPS-CH24P1 Toroidal Plasma Applicator Head

The split power train design allows for greater flexibility in chamber installations and easy access for servicing without breaking chamber vacuum. The RF powertrain remains coupled to the toroidal applicator head for greater plasma stability while the DC rectified power Product Features supply provides a SEMI F47 compliant source of power to the applicator head. A new magnetics design combined with new power boost electronics reduces power losses, enhances ignition repeatability, and increases plasma stability, resulting in improved reliability and repeatable performance.

Equipped with EtherCAT® communication protocols, the RPS-CH24P1 streams key parametric data enabling ontool or in-fab diagnostics. The actively cooled MKS lowfield toroidal applicator and proprietary, high purity Al2O3 coating deliver extremely long plasma applicator lifetimes to reduce fab operation expenses. When the unit does require routine maintenance, servicing the plasma block applicator can be accomplished without removing the power electronics, reducing service times.