Configuration Options

DLT2B-Analog Flow Ratio Controller, 2 Channels, Analog
DLT2B-DeviceNet Flow Ratio Controller, 2 Channels, DeviceNet
DELTA II 2-zone Flow Ratio Controller DLT2B-EtherCAT Flow Ratio Controller, 2 Channels, EtherCAT


  • Type
    Flow Ratio Controller
  • Full Scale Flow Range
    500/500 sccm, 1000/1000 sccm, 2000/2000 sccm, or 10000/10000 sccm
    (N2 equivalent)
  • Ratio Accuracy
    ±2% set point (for percent set points above 10%)
  • Channel Flow Control Range
    0, 5-100% Full Scale (EtherCAT)
  • Input Flow Range
    5-100% of each channel Full Scale rating (N2 equivalent)
  • Ratio Control Range
    1:1 to 20:1 and 20:1 to 1:1
  • Ratio Repeatability & Reproducibility
    0.02% of channel Full Scale
  • Resolution
    0.02% of channel Full Scale
  • Maximum Operating Outlet Pressure
    EtherCAT: 200 Torr at maximum flow rate through all channels
    DeviceNet & Analog: 200 Torr
  • Maximum Allowable Outlet Pressure Differential
    EtherCAT: 50 Torr with the same percentage flow through all channels (highest to lowest pressure channel)
    DeviceNet & Analog: 50 torr (between Q1 and Q2)
  • Normal Operating Pressure Differential
    <150 torr (<450 torr for 10000/10000) (N2)
  • Ratio Settling Time
    EtherCAT: <3 seconds (typical dependent on downstream conductance matching)
    DeviceNet: <3 seconds
  • Input Ratio Range
    1:1 to 20:1 and 20:1 to 1:1 (EtherCAT)
  • Ratio Repeatability
    ±0.3% of set point
  • Maximum Inlet Pressure
    150 psig (non-operational) (EtherCAT)
  • Zero Temperature Coefficient
    EtherCAT: <0.05% Full Scale/°C
    DeviceNet & Analog: 0.05% Full Scale/°C
  • Span Temperature Coefficient
    EtherCAT: <0.08% Reading/°C
    DeviceNet & Analog: 0.08% Reading/°C
  • Proof Pressure
    1000 psig (DeviceNet)
  • Burst Pressure
    1500 psig (DeviceNet)
  • Warm-up Time
    EtherCAT: 60 Minutes
    DeviceNet & Analog: 30 minutes
  • Operating Temperature
  • Storage Temperature
  • Storage Humidity
    0-95% relative humidity, non-condensing
  • Temperature Accuracy
  • Temperature Resolution
  • Fitting Type
    4 VCR male (non-rotatable)
  • Display
    4 digits for value, 4 characters for unit
  • External Leak Integrity
    <1x10-10 (scc/sec He)
  • Leak Integrity Through Closed Valve
    EtherCAT: < 2% of Channel Full Scale at 400 Torr differential to < 1 Torr
    DeviceNet & Analog: <2% of Channel FS at 400 torr differential
  • Wetted Materials
    316 stainless steel VAR, 316 stainless steel, Inconel®, KM-45, PTFE
    EtherCAT: Hastelloy®
  • Surface Finish
    5 microinch average Ra
  • Weight
    Less than 5 lbs. (2.3 kg)
  • Connector
    Analog: 9-pin Type "D" Male
    DeviceNet: 5-pin DeviceNet microconnector
    EtherCAT: 2 x RJ-45 (comm.) male, M8 male, 5 pin (power)
  • Power Requirements
    Analog: +15-24 VDC ±5%
    DeviceNet: 11-25 VDC
    EtherCAT: 24 VDC ±10% (10 Watts)
  • Power Consumption
    <9 Watts (DeviceNet)
  • Communication
    Analog, DeviceNet, or EtherCAT
  • Compliance
    CE (an overall metal braided, shielded able, properly grounded at both ends, is required during use).


Wide Dynamic Ratio Control Range

The DELTA II has a wider dynamic ratio control range and is more adaptive to different tool and process conditions. MKS has developed a unique patent pending ratio control algorithm enabling ratio and flow response times of less than two (2) seconds. This control algorithm also enables a twenty to one ratio control range, more than double its industry leading predecessor.

Tight Ratio Control While Changing Input Flow

The DELTA II maintains tight ratio control while the input flow is changed. Our unique patent pending ratio control algorithm enables ratio and flow response times of less than two seconds.

Embedded e-diagnostics

The DELTA II’s diagnostic feature allows the user to check the DELTA’s performance in-situ, lowering costs through reduced removal of “No Problem Found” devices. This feature is enabled through a web browser utility accessed through the device’s Ethernet port. This utility uses a standard web browser – no special software is required. For access, the IP address may be accessed through the devices bright LED display.

Flow Splitting Applications

Widely used in a variety of flow splitting applications such as etch, strip, and CVD, the DELTA II provides the user with the ability to distribute gas or gas mixtures to two different zones in a process chamber. Send the DELTA II a gas – or any mixture – and a ratio set point and the DELTA II will split the gas into two separate output channels automatically and precisely. 

Throughput and process control have always been critical to the semiconductor device manufacturer. With the advent of 300 mm wafers and dual process chambers, new methods of control gas flow distribution have become increasingly needed. 300 mm wafer processing often requires tunable control of gas distribution across the wafer to provide better process uniformity. Dual process chambers require proper gas distribution for chamber matching from single source gas panels.

Controller 9-pin Connector Pin-outs

 Pin  Description
 1  Valve Open/Close
 2  Ration Signal Output
 3  +15 VDC
 4  Power Common
 5  No Connection
 6  Ratio Set Point
 7  Signal Common
 8  Signal Common
 9  Remote Zero

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Contact an Applications Specialist by sending us an email