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Description
PDPCA Dual-zone, Integrated Pressure Controller, with Mass Flow Meter

Specifications

  • Type
    Dual Pressure Controller
  • Pressure Range
    20, 50, or 100 Torr, Full Scale
  • Fitting Type
    Swagelok® 4 VCR® male compatible
  • Pressure Control Accuracy
    ±1.0% set point1
  • Transducer Over Pressure Limit
    45 psia or 200% Full Scale, whichever is greater
  • Pressure Measurement Accuracy
    ±0.5% Reading
  • Zero Temperature Coefficient
    Pressure: <0.02% Full Scale/°C
    Flow: <0.05% Full Scale/°C
  • Span Temperature Coefficient
    Pressure: <0.04% Reading/°C
    Flow: <0.08% Reading/°C
  • Control Range
    10-100% Full Scale
  • Typical Response Time
    <2.0 seconds to set point, typical - dependent on system configuration and control settings
  • Operating Temperature
    15-50°C (59-122°F)
  • Storage Temperature
    -20 to 80°C (-4 to 176°F)
  • Storage Humidity
    0-95% Relative Humidity, non-condensing
  • External Leak Integrity
    <10-9 scc/sec He
  • Leak Integrity Through Closed Valve
    <1% Full Scale
  • Flow Measurement Range
    20, 50 or 100 sccm, Full Scale
  • Maximum Inlet Pressure
    45 psia
  • Flow Accuracy
    ±1.0% Full Scale
  • Wetted Materials
    316L Stainless Steel, Inconel®, Nickel, Elgiloy®, Viton®
  • Surface Finish
    Ra <10 µinches, electropolished
  • Input Power
    EtherCAT: +24 VDC (<5 watts)
    DeviceNet: +11 to 25 VDC (<4 watts), each channel
  • Connector
    EtherCAT: 2 x RJ-45 (comm.) male, M8 male, 5 pin (power)
    DeviceNet: M8, 5 pin micro connector (Power and Communications), each channel
  • Data Rate Switch
    EtherCAT: No switch
    DeviceNet: 4 positions: 125, 250, 500K (Default), Programmable over network.
  • EtherCAT Communication Rate
    100 Mbps
  • DeviceNet Communication Rate
    N/A
  • MAC ID Switches
    EtherCAT: 3 switches, 16 positions
    DeviceNet: 2 switches, 10 positions: 0,0 to 6,3. 1 to 254
  • Network Size
    EtherCAT: Up to 4095 nodes
    DeviceNet: Up to 64 nodes
  • Indicators
    EtherCAT: Up to 4095 nodes
    DeviceNet: LED Network (green/red); LED Module (green/red)
  • Meter Warm-up Time
    1 hour
  • Stability at set point
    <0.1% set point
  • Weight
    10.5 lbs. (4.8 Kg)
  • Dimensions
    10.46 (incl. fittings) x 3.36 x 5.35 in.
    26.56 (incl. fittings) x 8.53 x 13.59 cm

Features

  • Complete backside wafer cooling subsystem in a compact package
  • Two independent channels of pressure control, each with mass flow metering
  • With single package integration, size and complexity are reduced greatly
  • Can be used in any application requiring independent pressure control and mass flow metering to two distinct volumes
  • Tunable response for fast time to set point without pressure overshoot
  • Control stability of ±0.1% of set point

PDPCA Operation

The PDPCA has been designed to reduce the overall cost of ownership of pressure control subsystems for backside wafer cooling, specifically for the latest two-zone electrostatic chucks (Figure 1).

Two Zone Backside Wafer Cooling
Figure 1 — Two Zone Backside Wafer Cooling
PDPCA Functional Schematic
Figure 2 — PDPCA Functional Schematic

As shown in Figure 2, the PDPCA consists of four sections – an inlet subassembly, two PPCMA pressure control channels and an outlet subassembly. Pressurized helium gas is provided in the inlet subassembly. A pneumatic valve is then opened and the gas flow is split to two pressure control channels.

In the pressure control section, the PPCMA utilize MKS Baratron® capacitance manometers to measure pressure for each of the two zones. These pressures are compared to the pressure set points and an appropriate signal adjusts the position of the solenoid control valve to bring actual pressures into agreement with the set points. At the same time, mass flow is monitored on each channel by MKS mass flow meters calibrated for helium, which is the typical gas used for backside wafer cooling.

Downstream of the pressure control section, the outlet subassembly directs flow to the electrostatic chuck and provides a controlled "bleed" to vacuum through fixed orifices.

The purpose of the bleed is to insure that the pressure control system is not "dead-ended". Since leak past the wafer is typically very low, the controlled bleed provides additional pressure relief for faster response to set point.

The controlled bleed is done using a fixed orifice based sccm of helium at a 9 Torr set point.

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