Wafer Level Packaging Solutions

Wafer Level Packaging (WLP), where packaging components are attached to an integrated circuit (IC) allows integration of wafer fab, packaging, test, and burn-in at wafer level is frequently used for smartphone applications, where miniaturization and processor speed are critical.

Multiplate®  is a revolutionary plating tool addressing the plating requirements for both wafer and panel level packaging.

Wafer Level Packaging (WLP)

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MultiPlate® Electrochemical Plating System  
MultiPlate® is an innovative electrochemical deposition plating system designed to accommodate the challenges of advanced packaging applications.

Wet Chemical Process Solutions  
Atotech provides plating chemicals and equipment solutions for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors