Oxidation is an essential part of silicon wafer fabrication for manufacturing the integrated circuits (ICs) found in almost every electronic device manufactured today. Silicon dioxide has been one of the most important materials of the thin films employed for semiconductor device fabrication for more than a half century. Indeed, the fact that silicon forms a stable and adherent oxide with good electrical properties is probably the reason why.
A detailed discussion of the process used for thermal oxidation
Remote Plasma Sources
Generate low-energy ions and radicals to react with material surfaces and chamber walls, removing contaminants and act as a precursor for material deposition.
Baratron® Capacitance Manometers
For direct, gas independent, high accuracy pressure measurement
Mass Flow Controllers & Meters
Thermal & pressure based sensor technologies to bring products and processes to market faster, more reliably, and more cost effectively