Package Substrate Manufacturing Solutions
MKS’ portfolio consists of cost-effective, cutting-edge and environmentally conscious products includes a wide array of wet chemicals, equipment, laser drilling systems and process solutions for next generation flex / rigid flex, HDI and multilayer PCB and package substrate manufacturing.
Learn More:
MKS Handbook
Process Technologies in Advanced Packaging
Explore the Future of Semiconductor Integration and the engineering behind Advanced Packaging – the key to sustaining Moore’s Law in the post-scaling era.
A free book from MKS
Wet Chemical Processes, Production Equipment, and Service
Plating chemicals and equipment for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors from Atotech.
Substrate Processing Solutions
Leverage ESI’s laser expertise for PCB and substrate processing with a CO2 laser solution for HDI via drilling.
Ultra-High Velocity