Process Technologies in Advanced Packaging Handbook
Semiconductor advanced packaging processes, technologies, and applications

Dive deep into the Future of Semiconductor Integration and explore the engineering behind Advanced Packaging – the key to sustaining Moore’s Law in the post-scaling era.

As traditional transistor scaling approaches its physical limits, the semiconductor industry is turning to Advanced Packaging to maintain performance growth. This paradigm shift enables the integration of multiple heterogeneous dies into a single package, unlocking new levels of functionality, bandwidth, and power efficiency.

Our Process Technologies in Advanced Packaging Handbook is a comprehensive technical resource for anyone who wants to understand the next frontier in semiconductor design and manufacturing.

What you’ll gain from this handbook:

• A foundational understanding of heterogeneous integration and chiplet architectures
• Detailed insights into interposer technologies, through-silicon vias (TSVs), RDLs, and high-density interconnects
• Process flows and equipment used in 2.5D/3D packaging, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) solutions

Whether you're designing next-gen systems or studying semiconductor fabrication, this handbook will equip you with the technical depth to innovate in a rapidly evolving landscape.

Download the Handbook and get hands-on with the technologies shaping the future of electronics.