Cleanline® Foreline Plasma Clean System

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Overview

The MKS Cleanline® Foreline Plasma Clean System increases tool uptime and productivity by continuously removing process byproducts and deposits from CVD and Etch system pumping lines. This novel approach to foreline cleaning delivers atomic radicals from NF3 or O2 chemistry straight to where process deposits build up, such that they are immediately removed and do not accumulate.

The Cleanline system can be installed anywhere in the vacuum line, including at the chamber outlet, where it can improve particle performance. The internal geometry matches the conductance of standard piping and the plasma source can operate at typical foreline temperatures. This system is designed to be completely passive when not powered.

Increase tool uptime and productivity
Improve particle performance
Improve chamber matching and wafer-to-wafer matching

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	Description
	CLEANLINE Foreline Plasma Clean System

Features

Cleanline® Foreline Plasma Clean System for Removing CVD and Etch Processes Byproducts and Deposits

Cleaning performance ~ 1 µm of SiO2 powder removed, over 1 meter of pipe, in 1 minute
Conductance is equivalent to an open section of pipe for full process transparency
Plasma source can be heated to 150°C
Reliable ignition in process gas

Specifications

	KF40	KF50	ISO 80 mm
Wetted Materials	316L Stainless Aluminum Nitride Kalrez® 9500	316L Stainless Aluminum Nitride Kalrez® 9500	6061-T6 Aluminum Aluminum Nitride Kalrez® 9500
Flanges	KF40	KF50	ISO80
Length	3.175.in [80.6 mm]	3.25.in [82.5 mm]	7.15.in [181.6 mm]
Inner Diameter	1.41.in [35.8 mm] (same as KF40 pipe)	2.10.in [35.8mm] (Same as KF50 pipe)	2.86.in [72.64 mm] (same as ISO 80mm pipe)
Max Mechanical Axial Force	200 lbf Tensile or Compressive
Weight	2 lb	3.6 lb	9.5 lb
Max Mechanical Moment	100 ft*lb	100 ft*lb	200 ft*lb
Max Operating Temperature	<150°C
Gas Input: NF3 or F2 (with matching Argon flow)	<3 slm	<5 slm	<6 slm
Operating Pressure Range	0.15 - 3 Torr	0.15 – 3 Torr	0.25 – 5 Torr
Plasma Power (fixed)	50 W	50 W	200 W
Plasma Ignition	Any condition within Operating Flow and Pressure window; Optionally 100% Argon ( 0.25 – 5 Torr, <6 slm)
Typical Pipe Clean Rate	Up to 20 mg/min SiO2 powder ~60 sec/meter of 40mm pipe/µm of SiO2 powder	Up to 20 mg/min SiO2 powder ~60 sec / meter of 50mm pipe / µm of SiO2 powder	Up to 100 mg/min SiO2 powder ~60 sec/meter of 80mm pipe/µm of SiO2 powder
Typical Electrode Lifetime	2000 RF Hours
Helium Leak Rate	1 e^-9 atm*cc/sec
Compliance	CE RoHS 2021 SEMI S2

Power Supply/Controller Specifications
Dimensions	5.5.in W x 5.in H x 12.in D [139.7 mm W x 127 mm H x 304.8 mm D]
Input Power	100 – 132 VAC 50/60 Hz 6A Service (400W typical) 200 – 264 VAC 50/60 Hz, 6A Service (switch selectable)
Ambient Temperature	10-40°C Non-condensing
Weight	10 lbs
Cooling	Air Cooled, Rear Panel Fan (requires 2.in of clearance)
RF Output	1 Mhz
Interface	24 VDC Discrete Logic Input: Plasma On Command Output: Ready, RF On, Plasma On, Plasma Fault
Diagnostics	Ethernet Web Page Diagnostics via Front Panel RJ45

Features

Cleanline® Foreline Plasma Clean System for Removing CVD and Etch Processes Byproducts and Deposits

Cleaning performance ~ 1 µm of SiO2 powder removed, over 1 meter of pipe, in 1 minute
Conductance is equivalent to an open section of pipe for full process transparency
Plasma source can be heated to 150°C
Reliable ignition in process gas

Specifications

	KF40	KF50	ISO 80 mm
Wetted Materials	316L Stainless Aluminum Nitride Kalrez® 9500	316L Stainless Aluminum Nitride Kalrez® 9500	6061-T6 Aluminum Aluminum Nitride Kalrez® 9500
Flanges	KF40	KF50	ISO80
Length	3.175.in [80.6 mm]	3.25.in [82.5 mm]	7.15.in [181.6 mm]
Inner Diameter	1.41.in [35.8 mm] (same as KF40 pipe)	2.10.in [35.8mm] (Same as KF50 pipe)	2.86.in [72.64 mm] (same as ISO 80mm pipe)
Max Mechanical Axial Force	200 lbf Tensile or Compressive
Weight	2 lb	3.6 lb	9.5 lb
Max Mechanical Moment	100 ft*lb	100 ft*lb	200 ft*lb
Max Operating Temperature	<150°C
Gas Input: NF3 or F2 (with matching Argon flow)	<3 slm	<5 slm	<6 slm
Operating Pressure Range	0.15 - 3 Torr	0.15 – 3 Torr	0.25 – 5 Torr
Plasma Power (fixed)	50 W	50 W	200 W
Plasma Ignition	Any condition within Operating Flow and Pressure window; Optionally 100% Argon ( 0.25 – 5 Torr, <6 slm)
Typical Pipe Clean Rate	Up to 20 mg/min SiO2 powder ~60 sec/meter of 40mm pipe/µm of SiO2 powder	Up to 20 mg/min SiO2 powder ~60 sec / meter of 50mm pipe / µm of SiO2 powder	Up to 100 mg/min SiO2 powder ~60 sec/meter of 80mm pipe/µm of SiO2 powder
Typical Electrode Lifetime	2000 RF Hours
Helium Leak Rate	1 e^-9 atm*cc/sec
Compliance	CE RoHS 2021 SEMI S2

Power Supply/Controller Specifications
Dimensions	5.5.in W x 5.in H x 12.in D [139.7 mm W x 127 mm H x 304.8 mm D]
Input Power	100 – 132 VAC 50/60 Hz 6A Service (400W typical) 200 – 264 VAC 50/60 Hz, 6A Service (switch selectable)
Ambient Temperature	10-40°C Non-condensing
Weight	10 lbs
Cooling	Air Cooled, Rear Panel Fan (requires 2.in of clearance)
RF Output	1 Mhz
Interface	24 VDC Discrete Logic Input: Plasma On Command Output: Ready, RF On, Plasma On, Plasma Fault
Diagnostics	Ethernet Web Page Diagnostics via Front Panel RJ45