Microwaves: Driving the Next Leap in Semiconductor Scaling

Overview

As the semiconductor industry races toward 2nm and 1nm, the traditional limits of manufacturing are being redefined. At these dimensions, challenges such as quantum effects, extreme aspect ratios, and material limitations test every process step. Microwave technology is no longer a niche tool—it is emerging as a critical enabler for success at the most advanced nodes.

Microwaves: Driving the Next Leap in Semiconductor Scaling

Precision Where It Counts: Atomic-Level Control

Success at the leading edge depends on atomic-level accuracy. Microwave plasma supports Atomic Level processes with:

  • Unmatched Uniformity: Ensures consistent processing across the entire wafer surface.
  • Low Ion Energy: Protects fragile, ultra-thin structures from damage during fabrication.
  • High Selectivity: Enables precise etching and deposition for complex material stacks.

Impact for Engineers: This level of control translates directly to higher yield, reduced reworks, and a faster time-to-market for advanced chip designs.

Protecting the Thermal Budget

The ultra-thin materials and complex architectures of next-generation devices cannot tolerate the thermal stress of traditional high-temperature processes. Microwave technology offers:

  • Localized, Rapid Heating: Activates dopants and modifies materials precisely where needed, without damaging surrounding layers.
  • Precise Dopant Activation: Ensures optimal electrical performance with minimal thermal impact.
  • Reduced Stress: Preserves the integrity of advanced architectures.

Impact for Engineers: This level of control translates directly to higher yield, reduced reworks, and a faster time-to-market for advanced chip designs.

Enabling Advanced Packaging

The demands of hybrid bonding and 3D integration require pristine surfaces and tightly controlled interfaces. Microwave plasma ensures:

  • Complete Residue Removal: Leaves surfaces exceptionally clean for perfect adhesion.
  • Optimized Surface Chemistry: Modifies surfaces to enhance bonding strength.
  • Cleaner Interfaces: Creates superior interfaces for reliable chip stacking.

Impact for Engineers: Enables stronger bonds, better overall reliability, and scalable advanced packaging solutions.

MKS Microwave Systems: Your Partner in Process Advancement

At MKS, our microwave systems are engineered for the foundational demands of advanced fabrication. Leveraging decades of expertise in microwaves, plasma, and process integration, we deliver:

  • Precision, Repeatability, and Reliability: Systems designed for consistent and dependable performance in the fab.
  • Scalability Across Advanced Materials: Solutions that adapt to a wide range of cutting-edge materials and process requirements.
  • Seamless Fab Integration: Equipment that integrates smoothly into existing manufacturing workflows.

MKS helps leading fabs worldwide push Moore’s Law forward, enabling the breakthroughs that power the next generation of electronics

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