Sorry, this family of products is no longer available.

R*evolution® III 6 slm Remote Plasma Source

Overview

The R*evolution® III integrated remote plasma source, with improved capability over the earlier model, provides the highest performing and cleanest source of reactive gas species required in the processing of semiconductor wafers.

Specifications

Type

AX7695 Integrated Remote Plasma Source
Ignition Gas Supply

100% O2 or Ar, or 90% O2/10% N2 (contact MKS for ignition with other gases)
Process Gas Supply

Up to 6.0 slm of 100% O2, or 90% O2/10% N2 (contact MKS for ignition with other gases)
Operating Pressure

Ignition: 0.5 to 2.0 Torr @ 1.0 to 6.0 slm (pressure measured at R*evolution III outlet)
Process: 0.5 to 2.0 Torr @ 1.0 to 6.0 slm
Output

Ready, AC line, Plasma On, Power Monitor
Inputs

Plasma On/Off, Power Set
Duty Cycle

100%
Interlocks

Internal thermal switch and internal water flow switch to protect against insufficient cooling

Wetted Materials

6061-T6 Aluminum, Kalrez®, SiO2, 316L SS, Nickel, Fluorosilicone
Control Interface

Discrete I/O, 9 and 25 pin D connectors, RS-232, DeviceNet™ and Ethernet (MKS TOOLweb®-enabled)
Power Requirements

180 to 228 VAC, 50/60 Hz, 30A, 3 phase
Cooling Water

1.75 gpm, < 30°C
Operating Temperature

Ambient 40°C max.
Dimensions

15.7 inches long, 13.7 inches wide, 12.14 inches high (399 mm x 348 mm x 308 mm nominal)
Weight

85 lb. (38.6 Kg)
Compliance

CE, SEMI F47, SEMI S2 (includes S8, S10, S14 assessments), UL 61010-1, CAN/CSA-61010-1