Cleanline® Foreline Plasma Clean System
Overview
The MKS Cleanline® Foreline Plasma Clean System increases tool uptime and productivity by continuously removing process byproducts and deposits from CVD and Etch system pumping lines. This novel approach to foreline cleaning delivers atomic radicals from NF3 or O2 chemistry straight to where process deposits build up, such that they are immediately removed and do not accumulate.
The Cleanline system can be installed anywhere in the vacuum line, including at the chamber outlet, where it can improve particle performance. The internal geometry matches the conductance of standard piping and the plasma source can operate at typical foreline temperatures. This system is designed to be completely passive when not powered.
- Increase tool uptime and productivity
- Improve particle performance
- Improve chamber matching and wafer-to-wafer matching
Products
Configuration Options
Features
Cleanline® Foreline Plasma Clean System for Removing CVD and Etch Processes Byproducts and Deposits
- Cleaning performance ~ 1 µm of SiO2 powder removed, over 1 meter of pipe, in 1 minute
- Conductance is equivalent to an open section of pipe for full process transparency
- Plasma source can be heated to 150°C
- Reliable ignition in process gas
Specifications
| KF40 | KF50 | ISO 80 mm | |
|---|---|---|---|
| Wetted Materials | 316L Stainless Aluminum Nitride Kalrez® 9500 |
316L Stainless Aluminum Nitride Kalrez® 9500 |
6061-T6 Aluminum Aluminum Nitride Kalrez® 9500 |
| Flanges | KF40 | KF50 | ISO80 |
| Length | 3.175.in [80.6 mm] | 3.25.in [82.5 mm] | 7.15.in [181.6 mm] |
| Inner Diameter | 1.41.in [35.8 mm] (same as KF40 pipe) |
2.10.in [35.8mm] (Same as KF50 pipe) |
2.86.in [72.64 mm] (same as ISO 80mm pipe) |
| Max Mechanical Axial Force | 200 lbf Tensile or Compressive | ||
| Weight | 2 lb | 3.6 lb | 9.5 lb |
| Max Mechanical Moment | 100 ft*lb | 100 ft*lb | 200 ft*lb |
| Max Operating Temperature | <150°C | ||
| Gas Input: NF3 or F2 (with matching Argon flow) |
<3 slm | <5 slm | <6 slm |
| Operating Pressure Range | 0.15 - 3 Torr | 0.15 – 3 Torr | 0.25 – 5 Torr |
| Plasma Power (fixed) | 50 W | 50 W | 200 W |
| Plasma Ignition | Any condition within Operating Flow and Pressure window; Optionally 100% Argon ( 0.25 – 5 Torr, <6 slm) | ||
| Typical Pipe Clean Rate | Up to 20 mg/min SiO2 powder ~60 sec/meter of 40mm pipe/µm of SiO2 powder |
Up to 20 mg/min SiO2 powder ~60 sec / meter of 50mm pipe / µm of SiO2 powder |
Up to 100 mg/min SiO2 powder ~60 sec/meter of 80mm pipe/µm of SiO2 powder |
| Typical Electrode Lifetime | 2000 RF Hours | ||
| Helium Leak Rate | 1 e-9 atm*cc/sec | ||
| Compliance | CE RoHS 2021 SEMI S2 |
||
| Power Supply/Controller Specifications | |
|---|---|
| Dimensions | 5.5.in W x 5.in H x 12.in D [139.7 mm W x 127 mm H x 304.8 mm D] |
| Input Power | 100 – 132 VAC 50/60 Hz 6A Service (400W typical) 200 – 264 VAC 50/60 Hz, 6A Service (switch selectable) |
| Ambient Temperature | 10-40°C Non-condensing |
| Weight | 10 lbs |
| Cooling | Air Cooled, Rear Panel Fan (requires 2.in of clearance) |
| RF Output | 1 Mhz |
| Interface | 24 VDC Discrete Logic Input: Plasma On Command Output: Ready, RF On, Plasma On, Plasma Fault |
| Diagnostics | Ethernet Web Page Diagnostics via Front Panel RJ45 |
Resources
Literature
- Cleanline® Foreline Plasma Clean System (3.1 MB, PDF)
Drawings & CADs
- Cleanline® Foreline Plasma Clean System Dimensional Drawings (964.4 kB, PDF)
Ultra-High Velocity